GUNRAJ, Hayden; GUERRIER, Paul; FERNANDEZ, Sheldon; WONG, Alexander. SolderNet: Towards Trustworthy Visual Inspection of Solder Joints in Electronics Manufacturing Using Explainable Artificial Intelligence. Proceedings of the AAAI Conference on Artificial Intelligence, [S. l.], v. 37, n. 13, p. 15668–15674, 2024. DOI: 10.1609/aaai.v37i13.26858. Disponível em: https://ojs.aaai.org/index.php/AAAI/article/view/26858. Acesso em: 30 may. 2026.