CHRISTIAN, Stephone; MONTAQUE, Blayne; ARYAL, Saurav K. Time-Aware Two-Dimensional Packing for Slicing-Aware 3D Printing Throughput Optimization. Proceedings of the AAAI Symposium Series, [S. l.], v. 8, n. 1, p. 32–39, 2026. DOI: 10.1609/aaaiss.v8i1.42514. Disponível em: https://ojs.aaai.org/index.php/AAAI-SS/article/view/42514. Acesso em: 23 may. 2026.